INTEGRATED COMPACT IMPINGEMENT ON EXTENDED HEAT SURFACE

摘要

A thermal management system (56) that provides cooling to an electronic device (54) is disclosed. The thermal management system includes a surface (58) having a plurality of extended elements (62) thermally coupled to the surface, a plurality of vibrator assemblies (10) configured to generate a cooling flow across the surface, and a mounting structure (68) disposed atop the plurality of extended elements of the surface to position the plurality of vibrator assemblies relative to the surface. The mounting structure is configured to orient each of the plurality of vibrator assemblies to the surface at an angle (70), such that the cooling flow generated by the plurality of vibrator assemblies impinges on the extended elements at an angle.