| 摘要 |
<p>A heat-resistant engineering plastic which has a soldering heat resistance of from 10 to 60 seconds at 260 °C, is inexpensive and free from problems in molding, and has excellent resistance to thermal deterioration; and a heat-resistant molded article obtained therefrom, such as a connector for mounting on a substrate. The resin composition comprises a mixture obtained by melt-mixing an engineering plastic having an active site reactive with a specific functional group or having the active site incorporated therein with either an organic compound having the functional group and a polymerizable functional group in the same molecule or a polyolefin having the functional group. The molded article is characterized by being obtained by melt-molding the resin composition and irradiating the molding with an ionizing radiation.</p> |
