Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads

摘要

An integrated circuit (IC) die has a top side surface providing circuitry including active circuitry configured to provide a function, including at least one bond pad formed from a bond pad metal coupled to a node in the circuitry. A dielectric passivation layer is over a top side surface of a substrate providing a contact area which exposes the bond pad. A metal capping layer includes an electrically conductive metal or an electrically conductive metal compound over at least the contact area to provide corrosion protection to the bond pad metal, which is in electrical contact with the bond pad metal. The metal capping layer can extend over structures other than the bond pads, such as to cover at least 80% of the area of the IC die to provide structures on the IC die protection from incident radiation.

主权项

1. An integrated circuit (IC) die, comprising:
a substrate having a top side surface providing circuitry including active circuitry configured to provide a function, having at least one bond pad comprising a bond pad metal coupled to a node in said circuitry, and a dielectric passivation layer over said top side surface providing a contact area which exposes said bond pad, and a metal capping layer and having a first portion over at least said contact area in electrical contact with said bond pad metal and a second portion over the dielectric passivation layer not in electrical contact with any bond pad metal.