| 发明名称 | Covering structure, input device, and manufacturing method of covering structure | ||
| 摘要 | A covering structure including a bottom covering layer, a top covering layer, and a thermoplastic material layer is disclosed. The thermoplastic material layer is laminated between the bottom covering layer and the top covering layer. The thermoplastic material layer includes a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other. The first thermoplastic material layer part has a first thickness. The second thermoplastic material layer part has a second thickness. The first thickness is larger than the thickness of the top covering layer. The first thickness is 4˜7 times of the second thickness. The disclosure further discloses an input device using the covering structure and a manufacturing method of the covering structure. | ||
| 申请公布号 | US9229537(B2) | 申请公布日期 | 2016.01.05 |
| 申请号 | US201414255887 | 申请日期 | 2014.04.17 |
| 申请人 | Chicony Electronics Co., Ltd. | 发明人 | Chen I-Heng;Lin Chung-Yao;Lin Yu-Hsiu |
| 分类号 | G06F1/16;G06F3/02;B32B5/24;B32B9/02;B32B9/04;B32B7/12 | 主分类号 | G06F1/16 |
| 代理机构 | Blakely, Sokoloff, Taylor & Zafman LLP | 代理人 | Blakely, Sokoloff, Taylor & Zafman LLP |
| 主权项 | 1. A covering structure, comprising: a bottom covering layer; a top covering layer; and a thermoplastic material layer laminated between the bottom covering layer and the top covering layer, the thermoplastic material layer comprising a first thermoplastic material layer part and a second thermoplastic material layer part that are connected to each other, the first thermoplastic material layer part having a first thickness, the second thermoplastic material layer part having a second thickness, wherein the first thickness is larger than the thickness of the top covering layer, and the first thickness is larger than the second thickness. | ||
| 地址 | New Taipei TW | ||