RED FLIP CHIP LIGHT EMITTING DIODE, PACKAGE, AND METHOD OF MAKING THE SAME

摘要

Flip chip LEDs comprise a transparent carrier and an active material layer such as AlInGaP bonded to the carrier and that emits light between about 550 to 650 nm. The flip chip LED has a first electrical terminal in contact with a first region of the active material layer, and a second electrical terminal in contact with a second region of the active material layer, wherein the first and second electrical terminals are positioned along a common surface of the active material layer. Chip-on-board LED packages comprise a plurality of the flip chip LEDs with respective first and second electrical terminals interconnected with one another. The package may include Flip chip LEDs that emit light between 420 to 500 nm, and the flip chip LEDs are covered with a phosphorus material comprising a yellow constituent, and may comprise a transparent material disposed over the phosphorus material.

主权项

1. A chip-on-board light emitting diode package comprising:
a first flip chip light emitting diode constructed to emit light in a wavelength of from about 400 to 500 nm; and a second flip chip light emitting diode constructed to emit light in a wavelength of from about 550 to 650 nm, the first flip chip light emitting diode being positioned adjacent the second flip chip light emitting diode; wherein the first and second flip chip light emitting diodes are each encapsulated by a phosphor material comprising a yellow constituent.