| 摘要 |
The present invention relates to a method for removing a first substrate (2), which is connected to a second substrate (4) by a connecting layer (3, 3', 3", 3"', 3IV), from the second substrate (4) by making the connecting layer (3, 3', 3", 3"', 3IV) brittle. The present invention further relates to a corresponding device. The present invention furthermore relates to a method for bonding a first substrate (2) to a second substrate (4) with a connecting layer (3, 3', 3", 3"', 3IV) which can be made brittle, in particular by cooling. The present invention further relates to the use of a material, which can be made brittle, for producing a connecting layer (3, 3', 3", 3"', 3IV) between a first substrate (2) and a second substrate (4) for forming a substrate stack (1, 1', 1", 1 "', 1IV, 1V) which is formed from the first substrate (2), the second substrate (4) and the connecting layer (3, 3', 3", 3"', 3IV) which is arranged between said first substrate and said second substrate. The present invention also relates to a substrate stack formed from a first substrate (2), a second substrate (4) and a connecting layer (3, 3', 3", 3"', 3IV) which is arranged between said first substrate and said second substrate, wherein the connecting layer (3, 3', 3", 3"', 3IV) is formed from a material which can be made brittle. The present invention additionally relates to a sample holder for holding a first substrate (2) when the first substrate (2) is removed from a second substrate (4) with fixing means which can be activated by reducing the temperature. |
