发明名称 |
SINTERING MATERIALS AND ATTACHMENT METHODS USING SAME |
摘要 |
Methods for die attachment of multichip and single components may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput. |
申请公布号 |
SG10201509037S(A) |
申请公布日期 |
2015.12.30 |
申请号 |
SG10201509037S |
申请日期 |
2011.11.02 |
申请人 |
FRY'S METALS, INC. |
发明人 |
KHASELEV, OSCAR;SINGH, BAWA;MO, BIN;MARCZI, MICHAEL T.;BOUREGHDA, MONNIR |
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