发明名称 |
SYSTEM AND METHOD FOR FORMING BONDED SUBSTRATES |
摘要 |
An apparatus (100) for bonding two substrates (152, 172) includes a first roller (104), a second roller (108) that forms a nip (106) with the first roller, a substrate transport configured to move the first substrate and a second substrate through the nip simultaneously, and a controller. The controller operates the substrate transport to move the first substrate and the second substrate through the nip simultaneously, with a pattern of a hydrophobic material (140) on a first side of the first substrate engaging a first side of the second substrate. The first substrate engages the first roller, which has a higher temperature than the second roller, and the hydrophobic material penetrates the first and second substrates to bond the substrates together. |
申请公布号 |
EP2960055(A2) |
申请公布日期 |
2015.12.30 |
申请号 |
EP20150171657 |
申请日期 |
2015.06.11 |
申请人 |
XEROX CORPORATION |
发明人 |
BEACHNER, JAMES R.;ZHOU, JING;KANUNGO, MANDAKINI;JIA, NANCY Y.;MCCONVILLE, PAUL J.;HONG, WEI |
分类号 |
B32B37/06;B32B29/00;B32B37/12;B41J2/01;G01N35/00 |
主分类号 |
B32B37/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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