发明名称 Integrating VLSI-compatible fin structures with selective epitaxial growth and fabricating devices thereon
摘要 Different n- and p- types of device fins are formed by epitaxially growing first epitaxial regions of a first type material from a substrate surface at a bottom of first trenches formed between shallow trench isolation (STI) regions. The STI regions and first trench heights are at least 1.5 times their width. The STI regions are etched away to expose the top surface of the substrate to form second trenches between the first epitaxial regions. A layer of a spacer material is formed in the second trenches on sidewalls of the first epitaxial regions. Second epitaxial regions of a second type material are grown from the substrate surface at a bottom of the second trenches between the first epitaxial regions. Pairs of n- and p- type fins can be formed from the first and second epitaxial regions. The fins are co-integrated and have reduced defects from material interface lattice mismatch.
申请公布号 GB201520311(D0) 申请公布日期 2015.12.30
申请号 GB20150020311 申请日期 2013.06.28
申请人 INTEL CORPORATION 发明人
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