发明名称 CONFIGURABLE PRESSURE DESIGN FOR MULTIZONE CHEMICAL MECHANICAL PLANARIZATION POLISHING HEAD
摘要 A polishing head for chemical mechanical planarization is provided. The polishing head includes a housing and a flexible membrane secured to the housing. At least a first, second, and third pressurizable chamber are disposed in the housing and each chamber contacts the flexible membrane. A first pressure delivery channel couples to the first chamber. A second pressure delivery channel couples to the third chamber. A first pressure feed line couples the first pressure delivery channel to the second chamber. A second pressure feed line couples the second pressure delivery channel to the second chamber. A first manually movable plug interfaces with the first pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber. A second manually movable plug interfaces with the second pressure feed line to allow or block pressure from the first pressure delivery channel to the second chamber.
申请公布号 WO2015199815(A1) 申请公布日期 2015.12.30
申请号 WO2015US29034 申请日期 2015.05.04
申请人 APPLIED MATERIALS, INC. 发明人 OH, JEONGHOON;ZUNIGA, STEVEN, M.;NAGENGAST, ANDREW;HSU, SAMUEL, CHU-CHIANG;DANDAVATE, GAUTAM, SHASHANK
分类号 H01L21/304 主分类号 H01L21/304
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