Printed wiring board

摘要

A printed wiring board includes a first resin insulation layer, a second resin insulation layer formed on the first insulation layer and having an opening portion, a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion, an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer, and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer.

主权项

1. A printed wiring board, comprising:
a first resin insulation layer; a second resin insulation layer formed on the first insulation layer and having an opening portion; a second conductive layer formed on the second resin insulation layer; a mounting conductive layer formed on the first resin insulation layer in the opening portion of the second resin insulation layer such that the mounting conductive layer has a surface exposed by the opening portion; an electronic component positioned in the opening portion of the second resin insulation layer such that the electronic component is mounted on the surface of the mounting conductive layer; a filler resin structure formed on the electronic component and the second resin insulation layer, the filler resin structure comprising a resin material filling a space formed between the second resin insulation layer and the electronic component; a third conductive layer formed on the filler resin structure; a plurality of via conductors formed through the filler resin structure, the plurality of via conductors including a first via conductor connected to an electrode of the electronic component and a second via conductor connecting the third conductive layer formed on the filler resin structure and the second conductive layer formed on the second resin insulation layer; and a heat-dissipating via conductor formed in the first resin insulation layer such that the heat-dissipating via conductor is connected to the mounting conductive layer formed on the first resin insulation layer, wherein the heat-dissipating via conductor is a filled via comprising a plated material filling an opening formed through the first resin insulation layer, and the mounting conductive layer comprise a plated material same as the plated material of the heat-dissipating via conductor.