发明名称 Circuit board system comprising a cooling arrangement
摘要 A circuit board system includes a circuit board (101), at least one electrical component (102), and a conductor part (103) in heat conducting relation with the electrical component. A surface of the circuit board includes a portion (104) that is uneven so as to increase the surface area of the portion. The portion is coated with a coating (105) made of conductor material so that a surface of the coating is uneven. The circuit board includes a heat conductive pathway (106) made of conductor material and extending from the conductor part to the coating. Thus, the coating operates as a cooling element for cooling the electrical component.
申请公布号 US9226384(B2) 申请公布日期 2015.12.29
申请号 US201414172039 申请日期 2014.02.04
申请人 CORIANT OY 发明人 Holma Antti;Kohonen Petri
分类号 H05K7/20;H05K1/02 主分类号 H05K7/20
代理机构 Young & Thompson 代理人 Young & Thompson
主权项 1. A circuit board system comprising: a circuit board having a first surface and a second surface opposite to the first surface, at least one electrical component, and a conductor part in heat conducting relation with the electrical component, wherein: the first surface of the circuit board comprises a portion that is uneven so as to increase surface area of the portion, the portion of the first surface of the circuit board comprising at least one of the following for increasing the surface area of the portion: grooves, cavities the portion of the first surface is coated with a coating made of conductor material so that a surface of the coating is uneven, and the circuit board comprises a heat conductive pathway made of conductor material and extending from the conductor part to the coating.
地址 Espoo FI
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