发明名称 BLINKING DEVICE
摘要 The blinking device includes multiple power terminals, multiple load terminals, multiple contact switches, a control circuit, and multiple mounting substrates, and a case in a box shape for accommodating these therein. The multiple contact switches are individually associated with multiple power supply paths individually connected to multiple pairs each defined as a pair of one power terminal of the multiple power terminals and one load terminal of the multiple load terminals. At least one power supply path of the multiple power supply paths is formed on at least one of a front face, where at least one contact switch is mounted, and a rear face, where no contact switch is mounted, of each of the multiple mounting substrates. The case is configured to accommodate the multiple mounting substrates so that the multiple mounting substrates are stacked in a thickness direction.
申请公布号 US2015371799(A1) 申请公布日期 2015.12.24
申请号 US201314648695 申请日期 2013.12.06
申请人 PANASONIC CORPORATION 发明人 SUMINO Yasuhiro;SHIBATA Kiwamu
分类号 H01H47/00 主分类号 H01H47/00
代理机构 代理人
主权项 1. A blinking device, comprising: multiple power terminals to be connected to a power supply; multiple load terminals to be individually connected to different loads; multiple contact switches individually associated with multiple power supply paths individually connected to multiple pairs each defined as a pair of one power terminal of the multiple power terminals and one load terminal of the multiple load terminals; a control circuit for turning on and off the multiple contact switches; multiple mounting substrates each on which at least one contact switch of the multiple contact switches is mounted; and a case in a box shape for accommodating therein the multiple power terminals, the multiple load terminals, the control circuit, and the multiple mounting substrates, at least one power supply path of the multiple power supply paths being formed on at least one of a front face, where at least one contact switch is mounted, and a rear face, where no contact switch is mounted, of each of the multiple mounting substrates, and the case being configured to accommodate the multiple mounting substrates so that the multiple mounting substrates are stacked in a thickness direction.
地址 Osaka JP
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