| 摘要 |
PURPOSE:To improve the rate of automated package fabrication by a method wherein a plate which can be inserted directly into a package base plate is pressed into a heat-dissipating plate to be integrated therewith. CONSTITUTION:Embosses 21 and 21' are pressed into holes 11 and 11' respectively as indicated by solid line arrows so that a plate 2 is integrated with a heat- dissipating plate 1. On the occasion, the heat-dissipating plate 1 is fixed to the plate 2 in a stable manner by a heat-dissipating plate support 23. Subsequently, the legs 22 of the plate 2 are inserted automatically into component insertion holes 31 so that the heat-dissipating plate 1 and the plate 2 can be fixed temporarily to a package base plate 3 in the same way as other components, and then they are fixed thereto with solder simultaneously with other components inserted into the fixed temporarily to the base plate. |
