Verfahren zum Polieren von Halbleiterscheiben unter gleichzeitiger Anwendung einer elektrolytischen und einer mechanischen Behandlung,申请号DE19621446067-传众专利搜索

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发明名称	Verfahren zum Polieren von Halbleiterscheiben unter gleichzeitiger Anwendung einer elektrolytischen und einer mechanischen Behandlung
摘要
申请公布号	DE1446067(A1)	申请公布日期	1969.01.23
申请号	DE19621446067	申请日期	1962.04.27
申请人	TELEFUNKEN PATENTVERWERTUNGS-GMBH	发明人	BOGENSCHUETZ,DIPL.-CHEM.DR.RER.NAT.A.;KNOLL,A.
分类号	B24B37/04;C25F3/30;C25F7/00;H01L21/306	主分类号	B24B37/04
代理机构		代理人
主权项
地址

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