发明名称 |
METHOD FOR POLISHING SILICON WAFER, POLISHING COMPOSITION, AND POLISHING COMPOSITION SET |
摘要 |
Provided is a method for polishing a silicon wafer with which it is possible to effectively realize a high grade surface. The provided method for polishing a silicon wafer includes an intermediate polishing step for polishing using a polishing slurry (Sp) that contains abrasive grains, and a final polishing step for polishing using a polishing slurry (Sf) containing abrasive grains. A substance having a relative haze (Hp) that is more than 100% and less than 680% of the relative haze (Hf) of the polishing slurry (Sf) is used as the polishing slurry (Sp). |
申请公布号 |
WO2015194136(A1) |
申请公布日期 |
2015.12.23 |
申请号 |
WO2015JP02927 |
申请日期 |
2015.06.11 |
申请人 |
FUJIMI INCORPORATED |
发明人 |
TSUCHIYA, KOHSUKE;ASADA, MAKI |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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