| 摘要 |
The various embodiments described herein include systems, methods and/or devices used to packaging non-volatile memory. In one aspect, the method includes, selecting, from a set of non-volatile memory die, a plurality of non-volatile memory die on which predefined die-level and sub-die level tests have been deferred until after packaging, in accordance with predefined criteria and predefined statistical die performance information corresponding to the set of non-volatile memory die. The method further includes packaging the selected plurality of non-volatile memory die into a memory device. After said packaging, the method further includes performing a set of tests on the plurality of non-volatile memory die in the memory device to identify respective units of memory within the non-volatile memory die in the memory device that meet predefined validity criteria, wherein the set of tests performed include the deferred predefined die-level and sub-die level tests. |
