| 摘要 |
The present invention relates to a method for manufacturing an optimum state of a mold for manufacturing a semiconductor package. The method of the present invention can prevent environment pollution by removing a prior etching process and can significantly reduce a process time and manufacturing costs by simplifying a dummy manufacturing process, by including: (a) a dummy material preparation step for manufacturing a dummy to maintain an optimum state of a mold for manufacturing a semiconductor package; (b) a step of processing the prepared dummy material into a desired state; (c) a step of attaching an adhesive tape to one plane of the processed dummy material; (d) a step of moving the dummy material attached with the adhesive tape on one plane to a lead frame shift by accommodating the dummy material in a processed dummy storage part; (e) a step of moving the dummy material moved to the lead frame shift to the mold using a loader; (f) a step of preparing molding by putting the processed dummy material in the mold; (g) a step of performing pressurizing molding as to the dummy material processed in the mold and a molding resin comprised at one plane of the dummy material; (h) a step of extracting the dummy material and the molding resin pressurized and molded in the mold and then transporting the dummy material and the molding resin to a degate through an unloader; (i) forming a molding dummy by degating a remained gate of molding resin and the dummy material pressurized and molded at the degate side; and (j) accommodating the degated molding dummy in a molding dummy storage part by dropping the degated molding dummy. |
