| 摘要 |
The present invention provides a temporary adhering material for processing a wafer, a wafer processing laminate, and a manufacturing method for a thin wafer using the same, which can easily and temporarily attach a wafer having a circuit to a supporting substrate, has a high process suitability for a TSV forming process and a wafer back surface wiring process, can be easily exfoliated, and can increase the productivity of the thin wafer. The present invention is a temporary adhering material for processing a wafer for temporarily attaching a wafer, which has a circuit on the surface and whose back surface needs to be processed, to a supporting substrate, and comprises: a first temporary adhering layer which comprises a thermoplastic silicon modified styrene elastomer layer (A) which can be attached to the surface of the wafer to be able to be exfoliated; and, a second temporary adhering layer which comprises a thermohardening polymer layer (B) which is laminated on the first temporary adhering layer and can be attached to the supporting substrate to be able to be exfoliated. |
