发明名称 MANUFACTURING METHOD OF SOLID SUBSTRATE WITH CONDUCTIVE PATTERN AND SOLID SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide an easier manufacturing method of a solid substrate having a high definition conductive pattern.SOLUTION: The manufacturing method of a solid substrate with a conductive pattern including: a latent image agent pattern printing step [step (a)]; a metal salt formation step [step (b)]; a molding step [step (c)] for obtaining a solid substrate; a metal salt reduction step [step (d)]; and a plating step [step (e)], and the solid substrate with a conductive pattern are provided.
申请公布号 JP2015230918(A) 申请公布日期 2015.12.21
申请号 JP20140115108 申请日期 2014.06.03
申请人 DU PONT-TORAY CO LTD 发明人 KURIHARA HITOSHI
分类号 H05K3/18;H05K1/02 主分类号 H05K3/18
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