发明名称 METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BODY
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible circuit body that prevents a flexible wiring board from being worn due to friction, thereby achieving high reliability.SOLUTION: In a method for manufacturing a flexible circuit body, a thermoplastic elastomer is laminated on at least one surface of a flexible wiring board that includes an insulation film, a wiring layer formed on the insulation film and an insulation layer formed on the wiring layer, and then is formed into a predetermined shape at a temperature of a softening point or above and a melting point or below of the thermoplastic elastomer. The flexible wiring board includes a mounting component. A laminate film obtained by bonding an implanting thermoplastic resin with a thermoplastic elastomer is laminated on a wiring board, and a mounting component is implanted into the implanting thermoplastic resin to be laminated by heating at a temperature at which the implanting thermoplastic resin is fluidized.
申请公布号 JP2015228533(A) 申请公布日期 2015.12.17
申请号 JP20150187474 申请日期 2015.09.24
申请人 NIPPON MEKTRON LTD 发明人 YOSHIHARA HIDEKAZU;MATSUMARU AKIHIKO;KIMURA TAISUKE;KAJIYA ATSUSHI
分类号 H05K3/46;H05K3/28 主分类号 H05K3/46
代理机构 代理人
主权项
地址