发明名称 METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR PROCESSING SUBSTRATE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM
摘要 A method for manufacturing a semiconductor device includes forming a thin film containing a specific element and having a prescribed composition on a substrate by alternately performing the following steps prescribed number of times: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by alternately performing prescribed number of times: supplying a first source gas containing the specific element and a halogen-group to the substrate, and supplying a second source gas containing the specific element and an amino-group to the substrate, and forming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate.
申请公布号 US2015364318(A1) 申请公布日期 2015.12.17
申请号 US201514833480 申请日期 2015.08.24
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 HIROSE Yoshiro;YAMAMOTO Ryuji
分类号 H01L21/02;H01J37/32 主分类号 H01L21/02
代理机构 代理人
主权项 1. A method for manufacturing a semiconductor device, comprising: forming a thin film containing a specific element and having a prescribed composition on a substrate by alternately performing prescribed number of times: forming a first layer containing the specific element, nitrogen, and carbon on the substrate by alternately performing multiple number of times: supplying a first source gas containing the specific element and a halogen-group to the substrate, andsupplying a second source gas containing the specific element and an amino-group to the substrate; andforming a second layer by modifying the first layer by supplying a reactive gas different from each of the source gases, to the substrate.
地址 Tokyo JP