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发明名称
部品実装装置及び部品実装方法
摘要
申请公布号
JP5834212(B2)
申请公布日期
2015.12.16
申请号
JP20120182911
申请日期
2012.08.22
申请人
パナソニックIPマネジメント株式会社
发明人
味村 好裕;浜田 隆二;亀田 明
分类号
H05K13/04;H05K3/32
主分类号
H05K13/04
代理机构
代理人
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地址
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