| 摘要 |
PROBLEM TO BE SOLVED: To judge automatically a processing cross-section which becomes a true cross-section diameter in an FIB processing treatment of a semiconductor wafer. SOLUTION: The FIB processing device is provided with a step to photograph in order the processing cross-section which is FIB processed during a finishing process of the FIB processing, a step to obtain pattern dimensions on the processing cross-section based on the photographed image, a step to obtain a time function of the pattern dimensions based on the pattern dimensions and the photographed time, and a step to control the stop position of the FIB process based on the time function obtained by a functional operation means. COPYRIGHT: (C)2009,JPO&INPIT
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