| 发明名称 |
INSULATION PASTE FOR A METAL CORE SUBSTRATE AND ELECTRONIC DEVICE |
| 摘要 |
<p>The insulation paste of the present invention contains (a) a glass powder, and (b) an organic solvent, wherein one or both of alumina (Al203) and titanium oxide (TiO2) are contained in the paste as a glass diffusion inhibitor, and the content of this glass diffusion inhibitor is 12 to 50% by weight based on the content of inorganic component in the paste.</p> |
| 申请公布号 |
EP2155618(A1) |
申请公布日期 |
2010.02.24 |
| 申请号 |
EP20080771449 |
申请日期 |
2008.06.19 |
| 申请人 |
E. I. DU PONT DE NEMOURS AND COMPANY |
发明人 |
INABA, AKIRA;HAMAGUCHI, MASAKI;NAKAJIMA, NAOTO |
| 分类号 |
C03C8/02;C03C8/14;C03C8/20;H01B3/08;H01B3/10;H01L23/14 |
主分类号 |
C03C8/02 |
| 代理机构 |
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