| 摘要 |
<P>PROBLEM TO BE SOLVED: To enhance alignment precision. <P>SOLUTION: The semiconductor device includes: a substrate 102; an alignment mark 110 formed on the substrate 102 and composed of a metal film; a cover insulating film 104 formed on the alignment mark 110 and covering an entire surface of the alignment mark 110; and a polyimide film 106 formed on the cover insulating film 104, and having an opening 108, which is opened on the alignment mark 110 and has an end face 108a aligning with an end face 110a of the alignment mark 110, in plan view. <P>COPYRIGHT: (C)2010,JPO&INPIT |
