| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic-element-incorporated printed circuit board which can be applied to incorporate an electronic component having fine pitches (Pitch) as it largely improves alignment in coupling regions between a substrate circuit and an electronic element, also can minimize cost owing to a simple process, and is appropriate for obtaining two-layer incorporated substrate which has been difficult to be obtained by an existing electronic-element-incorporated board. <P>SOLUTION: The manufacturing method of an electronic-element-incorporated printed circuit board is characterized in that the method includes a step of mounting the electronic element having an electrode 11b formed on its upper surface on an upper surface of a bonding sheet 20, a step of mounting an insulator 30 having a cavity corresponding to the electronic element on the upper surface of the bonding sheet 20, a step of laminating first insulative resin on an upper surface of the insulator 30 to cover the upper surface of the electronic element, a step of grinding the first insulative resin to expose the electrode 11b, and a step of forming a first circuit pattern 51 electrically connected with the exposed electrode 11b on the ground first insulative resin 41. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
