| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem wherein distinguishing of defects generated during a process cannot be made from pseudo defects. SOLUTION: A distinguishing size for distinguishing a defect caused by a process trouble from other pseudo defects is stored in a distinguishing size storage area (21). Defect information is stored in a defect information storage area (17). A processing unit detects a defect on a wafer surface, on the basis of image data, and stores the defect information in the defect information storage area. Before a defect detection process is completed for all regions to be subjected to defect detection on the wafer surface, steps are performed which include: (SB3) of comparing the size of a defect detected in a region with the distinguishing size stored in the distinguishing size storage area; (SB5) of allowing an output unit to output an alarm that indicates a fault of an inspection apparatus, when the detected defect has a size equal to or larger than the distinguishing size; and (SB6) of executing the defect detection process for regions which have not been subjected to defect detection processings, when defects having a size equal to or larger than the distinguishing size have not been detected. COPYRIGHT: (C)2010,JPO&INPIT |
