ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL USING THE SAME, METHOD FOR CONNECTING CIRCUIT MEMBERS, AND CIRCUIT CONNECTION STRUCTURE

摘要

Disclosed is an adhesive composition which is used for bonding circuit members with each other and electrically connecting circuit electrodes of the circuit members with each other. This adhesive composition contains an adhesive component containing an epoxy resin, an epoxy resin curing agent, and an acrylic copolymer having a crosslinked structure and a weight average molecular weight of 30,000-80,000.