发明名称 WAFER ALIGNMENT APPARATUS AND WAFER ALIGNMENT METHOD THEREOF
摘要 A wafer alignment apparatus and a wafer alignment method are provided to align the wafer by using a lifting unit to lift a cassette stage. A cassette stage(13) is installed in a load lock chamber. A cassette(11) including a plurality of wafers is located in the cassette stage. The cassette stage is lifted by an elevator(14). A vent line converts the inner state of the load lock chamber from the vacuum state to the atmospheric pressure state. A mapping sensor is comprised of a light emitting unit and a light receiving unit. A detection sensor(19) senses the protrusion state of the wafer loaded in the cassette. A lifting unit(30) aligns the wafer by lifting the cassette stage. A controller(20) stops the corresponding process according to the sensing signal of a detection sensor. The controller controls the lifting unit.
申请公布号 KR20090064112(A) 申请公布日期 2009.06.18
申请号 KR20070131682 申请日期 2007.12.15
申请人 DONGBU HITEK CO., LTD. 发明人 KIM, JIN HYUNG
分类号 H01L21/68;H01L21/683 主分类号 H01L21/68
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