| 摘要 |
PROBLEM TO BE SOLVED: To solve the problems that a conventional heat dissipation substrate has less fixing power for irregular shaped components and that a thick-wall circuit conductor fixed to an insulating substrate may peel off. SOLUTION: More than part of an irregular shaped component 15 is fixed to a resin structure 11. The resin structure 11 is directly fixed to a metal plate 21 or the like, thereby raising a vibration resistance of the irregular shaped component 15 while locally raising an adhesive strength between a lead frame 19 and a heat conductive layer 20. A heat dissipation substrate 18 and a circuit board 24 are connected together using a connection wiring 22 by the shortest distance, improving a mechanical strength and a noise resistance of a module itself. COPYRIGHT: (C)2009,JPO&INPIT
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