| 摘要 |
A method for manufacturing probe card can form the bump of the probe of enough height without the photoresist layer formation process, and the repetition of polishing and etching removal process. The substrate(100) is prepared. The substrate comprises a plurality of wire portions and a plurality of upper surface terminals. A plurality of upper surface terminals is electrically connected to one end of a plurality of wire portions. The sacrificial substrate(300) is prepared. A plurality of concave grooves is formed on the sacrificial substrate. At this time, a plurality of recesses is formed in the location corresponding to a plurality of upper surface terminals. The conductive metal is filled with a plurality of concave grooves. Therefore, a plurality of bump(340) is formed The sacrificial substrate is adhered on the top of substrate. At this time, a plurality of bump corresponds to a plurality of upper surface terminals.
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