发明名称 |
BONDING METHOD |
摘要 |
<p>There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high-temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano-particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.</p> |
申请公布号 |
EP1578559(B1) |
申请公布日期 |
2009.03.18 |
申请号 |
EP20030788702 |
申请日期 |
2003.09.17 |
申请人 |
EBARA CORPORATION |
发明人 |
NAGASAWA, HIROSHI;KAGOSHIMA, KAORI;OGURE, NAOAKI;HIROSE, MASAYOSHI;CHIKAMORI, YUSUKE |
分类号 |
B23K35/02;B22F1/00;B22F7/06;B23K35/30;B23K35/36;C09J5/06;C09J11/04;H01L21/60;H01L23/482;H05K3/32 |
主分类号 |
B23K35/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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