| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To attach a semiconductor chip to a substrate in a state that the chip has a prescribed curved shape, with a simple configuration. <P>SOLUTION: Three kinds of bumps 11a-11c different in diameter size are bonded by linear arrayal along a pair of opposing edges 13a, 13b of a rigid substrate 13. The two bumps 11c in the smallest diameter size are arranged at the center part of the edge 13a along the edge 13a. The bumps 11b are arranged on the outer sides of the bumps 11c, and the bumps 11a in the largest diameter size are arranged on the outer sides of the bumps 11b. Then, the totally six bumps 11a-11c are arrayed along the edge 13a. The bumps 11a-11c are arrayed on the edge 13b in the same way as the edge 13a. A flexible solid-state image device 12 is covered from the upper part of the rigid substrate 13. While bending the solid-state image device 12 in a projected shape by blowing compressed air to the center part of the device 12, the electrode of the solid-state image device 12 is bonded to the bumps 11a-11c, to obtain a semiconductor device 10. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
