| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film that is softened by thermo-compression bonding as an adhesive and has improved embedding properties to the vicinity of the terminal of a bonding wire without extruding, in a semiconductor device in which the part in the vicinity of the terminal of the bonding wire is passed through the inside of the adhesive layer. SOLUTION: An adhesive film is the adhesive film that is used for a semiconductor device in which the part in the vicinity of the terminal of a bonding wire is passed through the inside of an adhesive layer. The adhesive film is characterized by containing an acrylic resin, an epoxy resin, a curing agent, and a curing accelerator. COPYRIGHT: (C)2009,JPO&INPIT
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