发明名称 Memory and manufacturing method thereof
摘要 A memory and a manufacturing method thereof are provided. The memory includes a dielectric layer, a polysilicon layer, a first buried diffusion, a second buried diffusion, a charge storage structure and a gate. The polysilicon layer is disposed on the dielectric layer and electrically connected to at least a voltage. The first buried diffusion and the second buried diffusion are separately disposed in the surface of the polysilicon layer. The charge storage structure is disposed on the polysilicon layer and positioned between the first buried diffusion and the second buried diffusion. The gate is disposed on the charge storage structure.
申请公布号 US2009057748(A1) 申请公布日期 2009.03.05
申请号 US20070892980 申请日期 2007.08.29
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 LAI ERH-KUN;LUE HANG-TING;HSIEH KUANG-YEU
分类号 H01L29/788;H01L21/8239 主分类号 H01L29/788
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