发明名称 ELECTRONIC PART MOUNTING STRUCTURE AND ITS MANUFACTURING METHOD
摘要 An electronic part mounting structure includes electronic part (2) having a plurality of electrode terminals (3), a substrate provided with connection terminals (6) in locations corresponding to these electrode terminals (3), and protruding electrode (7) for connecting one of electrode terminals (3) and one of connection terminals (6), where electrode terminal (3) of electronic part (2) and connection terminal (6) of substrate (5) are connected through protruding electrode (7), and protruding electrode (7) is formed of a conductive resin including a photosensitive resin and a conductive filler.
申请公布号 US2009026634(A1) 申请公布日期 2009.01.29
申请号 US20070278481 申请日期 2007.03.06
申请人 SAKURAI DAISUKE;YAGI YOSHIHIKO 发明人 SAKURAI DAISUKE;YAGI YOSHIHIKO
分类号 H01L23/52;H01L21/00 主分类号 H01L23/52
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