| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a dielectric material for a multilayer printed wiring board with built-in capacitor which allows an on-board capacitors with difference of more than one figure in the capacity density to be efficiently fabricated on a board, to provide a multilayer printed wiring board with built-in capacitor member and capacitor, and to provide a method for manufacturing a multilayer printed wiring board with built-in capacitor. <P>SOLUTION: The dielectric material includes a first metalization layer with thickness of 5 to 15μm, a first insulating layer with thickness of 0.1 to 1μm, a second metalization layer with thickness of 10 to 35μm, and a second insulating layer with thickness of 5 to 50μm, wherein the specific inductive capacity of the first insulating layer is in the 10 to 2,000 range, while the specific inductive capacity after the second insulating layer is cured with a half-cured resin material is in the 20 to 100 range. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
