| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for forming an interlayer insulation film, having good film characteristics such as permittivity, mechanical strengths, etc., used for an electronic device, also having a good close adhesion with a substrate plate, and further excellent in the stability of coating liquid. SOLUTION: This composition for the interlayer insulation film contains the following components. (A) A hydrolysate obtained by hydrolyzing an alkoxy silane or acyloxysilane having at least one carbon-carbon double bond under≤10 mass% substrate concentration. (B) A compound having at least two bonds selected from a carbon-carbon double bond and carbon-carbon triple bond in its molecule and (C) solvent. COPYRIGHT: (C)2008,JPO&INPIT
|
