| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a device capable of fitting an adhesive film for die bonding to the rear of each device divided by a dicing method easily without deteriorating the quality of the device. SOLUTION: The manufacturing method of a device comprises: a process for forming a division groove 210 with a prescribed depth along a scheduled divided line 21, polishing the rear of the wafer for exposing the division groove, and dividing the wafer into each device; an adhesive film fitting process for fitting an ultraviolet curing type adhesive film 6 to the rear of the divided wafer; a wafer support process for applying the side of the adhesive film of the wafer to a dicing tape fitted to an annular frame; an adhesive film curing process for curing a region corresponding to the division groove in the adhesive film by applying ultraviolet rays from the front side of the wafer; an adhesive film division process for dividing the cured adhesive film for each device by applying laser beams along the division groove; and a pickup process for picking up the device. COPYRIGHT: (C)2008,JPO&INPIT
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