| 摘要 |
<p>An IC fixing structure is disclosed which fixes an IC with no fixing part on a heat dissipation plate (30) using an IC fixing component (10). The IC fixing component (10) includes a locking case (12) accommodating the IC in such a manner that a side of the IC out of a face-to-face contact with the heat dissipation plate (30) is brought into a face-to-face contact with the locking case (12) so as to be covered and a through hole (11a) and a rotation stop protrusion (11b) inserted into a rotation limiting hole (32). After the IC has been accommodated in the locking case (12), a screw member inserted through the through hole (11a) is screwed into a screw hole (31) of the heat dissipation plate (30) so that the side of the IC out of face-to-face contact with the locking case (12) is pressed by the locking case (12) thereby to be brought into a face-to-face contact with the heat dissipation plate (30).</p> |
