发明名称 Method of etching nickel oxide layer
摘要 An etching method of a nickel oxide layer and a method of manufacturing a storage node of a resistive memory including the nickel oxide layer are provided. The method of etching the nickel oxide layer includes forming a nickel oxide layer on a substrate, forming a mask pattern on a desired region of the nickel oxide layer, removing the nickel oxide layer around the mask pattern using plasma generated from a mixed etching gas having a desired ratio of a main gas and an additive gas and removing the mask pattern.
申请公布号 KR100858082(B1) 申请公布日期 2008.09.10
申请号 KR20060101047 申请日期 2006.10.17
申请人 发明人
分类号 H01L27/115;H01L21/302 主分类号 H01L27/115
代理机构 代理人
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