| 摘要 |
A processing system, a processing method, and a storage medium storing computer program are provided to automatically and accurately maintain uniformity of a film thickness of a film formed on a semiconductor wafer by adjusting a flow rate of the gas supplied to the wafer. A wafer(W) to be treated is received in a process chamber(2). Process gas supply members(16-20) supply process gas into the process chamber. A process condition memory stores process conditions including a mass flow rate of the process gas supplied from the process gas supply members. A model memory stores a flow rate-result relation model, which represents a relation between a mass flow of the process gas and a process result. A mass flow calculator(50) receives the process result at the process condition stored in the process condition memory, and calculates the mass flow of the process gas based on the process result and the flow rate-result relation stored in the model memory. Process members(21-25) change the mass flow of the process gas to the calculated flow rate of the mass flow calculator, and processes the water by using the calculated flow rate.
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