| 摘要 |
PURPOSE: A probe polishing method, a program thereof, and probe apparatus are provided to detect abnormal material on upper face of a wafer and to eliminate foreign material authentically from a grinding wafer. CONSTITUTION: A first accepting unit(20) accepts a grinding wafer. An image capturing unit(19A) photographs the upper side of the grinding wafer loaded on a mounting unit. A second accepting unit(21) accepts the grinding wafer detecting the foreign material with a imaging device.
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