| 摘要 |
<p>PURPOSE: A fuse part of a semiconductor device and a method for forming the same are provided to improve efficiency of laser repair by forming the thickness of a remaining insulation layer in an upper side of each blowing pad differently by forming a step between blowing pads. CONSTITUTION: A fuse part(200) of a semiconductor device includes an insulation layer and a fuse(202). An insulation layer is formed on a substrate. The fuse is formed on the upper side of the insulation layer. The fuse includes a plurality of blowing pads(202A,202B,202C) for irradiating the laser. The blowing pads include respective laser coordinates.</p> |
