GUIDE CHUTE FOR SEMICONDUCTOR PACKAGE MANUFACTURING MACHINE

摘要

PURPOSE: A guide chute for a semiconductor package manufacturing machine is provided to prevent the damage of semiconductor packages by blocking interference between leads when pairs of the semiconductor packages are guided through the guide chute. CONSTITUTION: A first guide groove(52) and a second guide groove(53) are formed on the upper side of a main block(51). The first guide groove and the second guide groove guide pairs of semiconductor packages which are separated from a lead frame. A cover block is combined to the upper side of the main block to be detachably. A first and second upper guide grooves are formed to guide the upper side of the semiconductor packages on the corresponding locations of the first and second guide grooves.