发明名称 Semiconductor device and method of manufacturing the semiconductor device
摘要 A semiconductor device includes a pair of first source/drain regions disposed on a silicon substrate. A first silicon epitaxial layer pattern defines a gate forming region that exposes the silicon substrate between the pair of first source/drain regions. A first gate insulation layer is disposed on the silicon substrate in the gate forming region. A second gate insulation layer is disposed on a sidewall of the first silicon epitaxial layer pattern. A second silicon epitaxial layer pattern is disposed in the gate forming region and on the first silicon epitaxial layer pattern. A pair of second source/drain regions is disposed on the second silicon epitaxial layer pattern. A third gate insulation layer exposes the second silicon epitaxial layer pattern in the gate forming region and covers the pair of second source/drain regions. A gate is disposed on the second silicon epitaxial layer pattern in the gate forming region.
申请公布号 US7714380(B2) 申请公布日期 2010.05.11
申请号 US20070984012 申请日期 2007.11.13
申请人 DONGBU ELECTRONICS CO., LTD. 发明人 LIM TAE-HONG
分类号 H01L29/78 主分类号 H01L29/78
代理机构 代理人
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