| 摘要 |
<p>1279585 Soldering SIEMENS AG 19 April 1971 [30 Jan 1970] 20601/71 Heading B3R [Also in Division H1] A semi-conductor body is secured to a metal base by dip soldering, the base being masked by pressing on a foil of a ductile material not wettable by the solder and having an opening exposing the area of attachment. A base member 2 of Fe or Cu is mounted in a jig comprising a plate 7 of Al or steel by means of a nut 8 screwed on to the stud 3. A foil 10 of Al having a central opening is pressed over the base member 2 by means of a shaped rubber punch (9, Fig. 1, not shown) so that the foil masks the surface of the base member except for the mounting area 12. A Ni plated Si diode 15 is placed on the mounting area and held in place by a connecting wire 17. The assembly is then dip-soldered, using a Pb 4% Sn solder, to secure the body 15 to the base member 2 and to the wire 17. The Al masking foil is removed and a housing top including a ceramic or glass insulator is slipped over the connecting wire and welded to the base member, Fig. 4 (not shown).</p> |
