| 发明名称 |
Device and method for bonding wafers |
| 摘要 |
The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.
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| 申请公布号 |
US7598152(B2) |
申请公布日期 |
2009.10.06 |
| 申请号 |
US20050053976 |
申请日期 |
2005.02.09 |
| 申请人 |
THALLNER ERICH |
发明人 |
THALLNER ERICH |
| 分类号 |
H01L21/30;H01L21/00;H01L21/18;H01L21/20;H01L21/46;H01L21/68 |
主分类号 |
H01L21/30 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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