Photosensitive polyimide resin composition

摘要

The developability of a photosensitive polyimide resin composition with a weakly alkaline aqueous solution is improved without reduction in the solubility in general-purpose organic solvents even when a part of the diamine component is replaced with a diaminopolysiloxane-based compound or a bis(aminobenzoate)-based compound in order to reduce the warpage characteristics of the photosensitive polyimide resin composition by reducing its modulus of elasticity. The photosensitive polyimide resin composition is capable of being developed in a positive manner with a weakly alkaline aqueous solution and is soluble in an organic solvent. The photosensitive polyimide resin composition contains: a polyimide resin including a polyimide unit represented by formula (1) and a polyimide unit represented by one of formulas (2) and (3); an analogue of melamine cyanurate; and an analogue of diazonaphthoquinone. The amount of the analogue of melamine cyanurate is in the range of from 5 to 50 parts by weight with respect to 100 parts by weight of the polyimide resin.